Manufacturing Footprint

Manufacturing and R&D Footprint

We place heavy emphasis on R&D for both new product and technology development, focusing on the advancement of the next generation of high-speed interconnects and power distribution solutions as well as innovative manufacturing solutions.

Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, the Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes. We relentlessly seek improvements of our products, increasing our solutions’ overall cost effectiveness, precision and reliability. This ensures that we meet or even surpass the ever changing needs and expectations of market trends.