Airmax VS®

The AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by AFCI, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications.

The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS® connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.

This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost.

Further enhancements of the AirMax® product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs.

TARGET MARKET / APPLICATION

Communications
  • Switches
  • Routers
  • Access
  • Optical Transmission
  • Wireless Base Stations
Data
  • Servers
  • Switches
  • Storage
Industrial & Instrumentation
  • Test & Measurement
  • Medical
Want to know more
Features
Benefits
  • Innovative shieldless design and air dielectric between adjacent conductors
  • Reduces cost, improves flexibility and delivers low insertion loss and crosstalk
  • Open Pin Field Design
  • Allows mixing of differential pair signals, single ended signals, power and control lines within a standard connector module
  • Connector available in modules with 3, 4, or 5 pairs per column and 6, 8, or 10 columns per module. 85 ohm versions also available
  • Enables system configuration using common, off-theshelf modules
  • Simplifies design, supply chain management, inventory, and scheduling
  • Backward mating-compatible interface
  • Allows designers to choose the right combination for any specific system using common components, reducing cost and lead times
  • CAirMax signal, power, and guidance modules in stock at most distributors
  • Assurance of supply, short lead times, and competitive pricing all reduce risk to the OEM and contract manufacturers
  • Adopted by multiple industry standard architectures, including Storage Bridge Bay and Serial CPCI
  • Reduces connector cost, weight, and PCB routing complexity
  • Available with headers or receptacles on the backplane
  • Standard configuration and part numbers accelerate your design and reduce risk
  • Innovative shieldless edge couple technology and air dielectric between adjacent conductors
  • 3mm pitch between columns enables two different pairs to route between columns, reducing board layer count, complexity, and system cost
  • For more information on the following technical documents, please send your request by submitting the Request Form:
     
    Capability matrix
    Electrical model
    Qualification report
    SI report
    Test report