The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. AFCI’s long tradition as a BGA connector innovator assures expertise and reliability in the GIG-ARRAY® BGA design.

The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100-Ohm differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.

AFCI has produced BGA mezzanine connectors since 1996, shipping over 10 billion BGA contact interfaces demonstrating AFCI’s extensive experience as the premier BGA interconnect innovator and supplier. AFCI’s patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-of-the-art manufacturing facility.


  • Transmission
  • Access
  • Switching
  • Optics
  • Networking
  • Servers
  • Storage
Industrial & Instrumentation
  • Industrial controls & equipment
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Features & Benefits


RoHS-compliant (lead-free) options are available
Optimized design for utilization in high-density, high-speed mezzanine applications
Ball Grid Array (BGA) termination for process friendly attachment
1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance
Stack heights available from 15mm to 40mm provide mezzanine design flexibility
Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements
100 Ohm differential pair matched impedance assures consistent high speed peformance
Dual beam signal contacts provide two points of contact increasing product reliability
Polarized design assures proper mating of the connector
For more information on the following technical documents, please send your request by submitting the Request Form:
Capability matrix
Electrical model
Qualification report
SI report
Test report