MEG-Array®

The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.

1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high speed signal integrity at speeds up to 28Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights.

AFCI’s advanced manufacturing supports a patented BGA interconnect design. Multiple in-process vision systems monitor BGA contact integrity including solder sphere size, location and co-planarity plus other critical-to-function attributes.

TARGET MARKET / APPLICATION

Communications
  • Transmission
  • Access
  • Switching
  • Optics
  • Networking
Data
  • Servers
  • Storage
Industrial & Instrumentation
  • Industrial controls & equipment
  • Analytical & diagnostic
  • Medical
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Features & Benefits

 

High density, high speed, discrete contact, array connector
- Flexible ground distribution optimizes high speed signal integrity
- 10Gb/s differential pair performance with under 1% cross-talk
- 28Gb/s high speed performance documented for 4mm and 6mm stack height
- Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
- 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to save space
- Dual-point, long wipe contacts
Wide range of sizes and PCB stack heights increase mechanical design flexibility
- 6 PCB Stack heights: 4mm to 14mm
- 8 sizes: 81 to 528 positions
Revolutionary, trusted BGA interconnect platform
- High density standard BGA attachment lower assembly costs by using standard SMT processes
- BGA natural surface tension provides self-alignmen and self-leveling for multiple connector usage
- Patented BGA contact attachment preserves solder ball positioning
- Optimized PCB routing enhances electrical performance ball positioning
Quality and Reliability
- Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
- 22+ year old solder joint reliabiltity per IPC-SM-785
- 17 Billion + lines shipped to customer satisfaction
- Precious metal plating options satisfying varying customer needs for environmental resistance
For more information on the following technical documents, please send your request by submitting the Request Form:
 
Capability matrix
Electrical model
Qualification report
SI report
Test report