The TwinMezz® connector system provides superior electrical performance at the highest data rates, the highest signal density, and the lowest insertion force when compared to other available mezzanine connectors. Industry-leading signal integrity performance makes it the only choice capable of meeting the design requirements for 20+Gb/s mezzanine applications.

With 6 differential signal pairs per column, the system provides maximum signal density - delivering 25 pairs/cm2 , or 161 pairs/in2 . The innovative hermaphroditic design “mates to itself” reducing the number of part variations needed to accomplish stack heights ranging between 12mm and 40mm with 200-800 total contacts.

The TwinMezz® connector system provides exceptional flexibility with integrated molded or optional metal guides and the capability to mix signal and power wafers in a single connector. The versatile open pin field design offers additional flexibility by allowing for mixed differential, single-ended or power pin assignments in a single connector.

TwinMezz® connectors also feature AFCI’s patented BGA connector termination for easy surface-mount attachment and efficient trace routing.


  • Transmission
  • Access
  • Switching
  • Optics
  • Networking
  • Servers
  • Storage
Industrial & Instrumentation
  • Industrial Controls
  • Analytical & Diagnostic
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Features & Benefits


1.0 x 1.3 mm contact grid provides high signal density: 25 pairs/cm2 (161 pairs/in2)
6 differential signal pairs per column
Shield-less design provides the lowest possible loss
Open pin field design with no designated grounds allows for differential, single-ended or power pin assignments in a connector
Capability to address a range of applications
- 200 to 800 contacts/connector
- Stack heights from 12mm to 40mm
2.0mm (nominal) wipe length and redundant split-beam contacts enhance reliability
Integrated guidance compensates for ± 2.0mm misalignment in all directions
Optional power contacts
Proven AFCI Ball Grid Array (BGA) technology enables reliable, SMT-compatible attachment
RoHS compliant (lead-free) options
For more information on the following technical documents, please send your request by submitting the Request Form:
Capability matrix
Electrical model
Qualification report
SI report
Test report