D-Sub Pin in Paste Connectors

The D-Subminiature connectors are one of the most popular I/O solutions, addressing segments such as Telecommunications, Industrial, Instrumentation and Medical. Thanks to this very complete D-Subminiature range, AFCI is one of the most experienced suppliers. Now we are at the forefront once again in bringing you Pin-in-Paste (Through Hole Reflow) versions.

Pin-in-Paste technology (PIP) allows the use of Through Hole product in SMT manufacturing processes. The connectors are automatically or manually placed on the board, and then soldered in the same operation as the SMT components. Thanks to the Pin-in-Paste technology, the mechanical strengths of the Through Hole Technology soldering is maintained - still an important requirement for connectors nowadays in many industrial or telecom applications.

TARGET MARKET / APPLICATION

Data
  • Desktops/ Laptops
  • UPS, Storage systems
  • Routers, Servers
  • Printers, Copiers
Communcation
  • Base Stations
  • Switching
  • Transmission
  • Asymmetric Digital Subscriber Line (ADSL)
Consumer Electronics
  • Set-top-boxes
  • Energy meters
Military
  • Avionics
  • Military Equipment
Others
  • POS & Handheld terminals
  • Renewable Energy
  • Automotive Diagnostics
  • Surveillance Camera
  • Office Automation
  • Parking Meters
  • Gaming Machines
Industrial & Instrumentation
  • Robotics
  • Control Drives
  • Power Supplies
  • Medical Instruments
  • Test Equipments
Want to know more
Features
Benefits
  • A Basic I/O connector comes with five shell size and housing design
  • Most popular Rugged and sturdy I/O connector
  • Has a D-shaped shell design
  • Supports the need for polarisation
  • Meets DIN 41652 and MIL-C-24308 dimensional standards
  • Interchangable and intermateable with other makes
  • Dsub connectors use machined as well as stamped contacts
  • Suitable for signal and high-end applications
  • High desity Dsub connectors can accommodate more number of contacts in the basic shell sizes
  • Answer to the increasing need for higher density packaging
  • Power connectors both full and mixed layout available for PCB & Cable applications
  • Suitable for High current application
  • Pin In Paste Dsub connectors are derived from the solder to board design providing robustness and pre-existing true positioning
  • Applied cost is lower than SMT process
  • Pin In Paste use a through hole technology to solder connectors on boards by using a reflow process
  • Traditional Wave soldering can be avoided
  • A Basic I/O connector comes with five shell size and housing design
  • Most popular Rugged and sturdy I/O connector
  • Pin-in-Paste connectors comes in Tape & Reel packaging
  • Time saving as it can be automatically positioned on the board using pick and place processes
  • Pin-in-Paste connectors is a more stable process than wave soldering as it does not need constant adjust once set-up
  • Higher product quality ensured
  • No re-design of the board in Pin-in-Paste
  • Same Pcb layouts with same hole dia can be used
  • PiP uses through hole pins and metal pegs
  • Higher robustness compared to SMT
  • Dsub press-fit connectors comes with eye of the needle termination combined with a special flat rock design
  • Allow easy press fit mounting and helps to replace wave soldering method
  • Economy range with lower durability cycles designed for less demanding applications
  • Robust and reliable connectors at competitive price
  • Various PCB and Panel mounting accessory options available
  • Wide variety of choices for secure connection
  • Hoods available in plastic, metalised and metallic form with locking screws
  • Supports cable connection; Prevents risks of pulling up and accidental unmating
  • Pin-in-Paste connectors comes in Tape & Reel packaging
  • Time saving as it can be automatically positioned on the board using pick and place processes
  • For more information on the following technical documents, please send your request by submitting the Request Form:
     
    Capability matrix
    Electrical model
    Qualification report
    SI report
    Test report