AFCI’s DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals, while taking customers equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
The DensiShield® connector is built around a wafer system employing a differential pair construction where each pair is shielded from the adjacent pair and the adjacent wafer. The 8-pair connector is ideally suited for 4 bi-directional channels working at >2.5Gb/s, similar to Infiniband or XAUI links, but can also perform at much higher data rates.
The DensiShield® connector’s design for long engagement and low profile not only allows for more compact cable routing in systems, when compared to other high speed cabling systems, but it is also capable of being used in dense system designs whose board-to-board spacing is as low as 15mm.
The connector can also be configured to handle low-speed signals and power and is also available in selectivelyloaded versions, thereby allowing system designers to benefit from the density and robustness offered by this connector system in I/O applications that do not require high-speed signaling.