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TwinMezz®

Overview

Overview

Features
  • 1.0 x 1.3 mm contact grid provides high signal density: 25 pairs/cm2 (161 pairs/in2)
  • 6 differential signal pairs per column
  • Shield-less design provides the lowest possible loss
  • Open pin field design with no designated grounds allows for differential, single-ended or power pin assignments in a connector
  • Capability to address a range of applications
  • - 200 to 800 contacts/connector
  • - Stack heights from 12mm to 40mm
  • 2.0mm (nominal) wipe length and redundant split-beam contacts enhance reliability
  • Integrated guidance compensates for ± 2.0mm misalignment in all directions
  • Optional power contacts
  • Proven Amphenol FCI Ball Grid Array (BGA) technology enables reliable, SMT-compatible attachment
  • RoHS compliant (lead-free) options
Target Market / Application
Communications
  • Transmission
  • Access
  • Switching
  • Optics
  • Networking
Data
  • Servers
  • Storage
Industrial & Instrumentation
  • Industrial controls
  • Analytical & diagnostic
Documentation

Documentation

Configure Your Product

Configure Your Product

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Part Numbers

Part Numbers

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Grouped product items
Part Number Description Product Drawing Status
TwinMezz®

6 Pair, 19mm Stack Module, 600 Position (30 Columns)

Product Drawing
pre_released
Status pre-released
Check Stock
TwinMezz®

6 Pair, 19mm Stack Module, 600 Position (30 Columns), Lead Free

Product Drawing Check Stock
View as Grid List

2 Items

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Test Report

Test Report

Kindly contact Amphenol FCI for test report.

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